| PART |
Description |
Maker |
| 121-27239 121-27239-00-260 121-27239-03 121-27239- |
POWER TERMINAL 100 x 300 GRID - 10 PIN
POWER TERMINAL .100 X .300 GRID - 10 PIN
|
Winchester Electronics Corporation
Winchester Electronics ...
|
| MJE585006 MJE5850G MJE5852G MJE5850 MJE5851 MJE585 |
8 AMPERE PCP SILICON POWER TRANSISTORS 300 - 350 - 400 VOLTS 80 WATTS 8 A, 300 V, PNP, Si, POWER TRANSISTOR, TO-220AB
|
ONSEMI[ON Semiconductor]
|
| APT30M40LVFR APT30M40B2VFR APT30M40B2VFRG |
Power FREDFET; Package: T-MAX™ [B2]; ID (A): 76; RDS(on) (Ohms): 0.04; BVDSS (V): 300; 76 A, 300 V, 0.04 ohm, N-CHANNEL, Si, POWER, MOSFET
POWER MOS V FREDFET
|
Microsemi, Corp.
ADPOW[Advanced Power Technology]
|
| 87663-9006 |
Description: 6.35mm (.250) Pitch Power (DC), 7.62mm (.300) Pitch Power (AC), 2.54mm (.100)Pitch Signal, EXTreme PowerPlus Board-to-BoardHeader, Through Hole, Right
|
Molex Electronics Ltd.
|
| NPR2-T221 NHS2-T221 NHR2-T221 NPS2-T220 NPS2-T221 |
RESISTOR, METAL GLAZE/THICK FILM, 1.5 W, 1; 2; 5 %, 50; 100; 300; 600 ppm, 0.02 ohm - 100000 ohm, THROUGH HOLE MOUNT TO-220
RESISTOR, METAL GLAZE/THICK FILM, 1.5 W, 1; 2; 5 %, 50; 100; 300; 600 ppm, 0.02 ohm - 100000 ohm, SURFACE MOUNT TO-220
RESISTOR, METAL GLAZE/THICK FILM, 1.5 W, 1; 2; 5 %, 50; 100; 300; 600 ppm, 0.02 ohm - 100000 ohm, THROUGH HOLE MOUNT TO-221
Power Resistors
|
Riedon, Inc.
Riedon Powertron
|
| KSC2330YNBU KSC2330YTA KSC2330YH2TA KSC2330ONBU |
100 mA, 300 V, NPN, Si, SMALL SIGNAL TRANSISTOR TO-92L, 3 PIN
NPN Epitaxial Silicon Transistor; Package: TO-92L; No of Pins: 3; Container: Ammo 100 mA, 300 V, NPN, Si, SMALL SIGNAL TRANSISTOR
|
Fairchild Semiconductor, Corp.
FAIRCHILD SEMICONDUCTOR CORP
|
| PL342 PL34120191000GDDC PL34120191000KKEX PL341201 |
High Sensitivity Chip Sensors Sideview Type; Type: Sideview Resin; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±14; Dark
Infrared Light Emitting Diodes Top View Type; Type: Surface Mount Type (Sideview); Peak light emitting wavelength P (nm): 950; Half viewing angle
Infrared Light Emitting Diodes Top View Type; Type: Sideview Resin; Peak light emitting wavelength P (nm): 950; Half viewing angle 1/2 (deg): ±
High Sensitivity Chip Sensors Sideview Type; Type: Sideview Resin; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±32; Dark
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 203; Print width (mm): 56; Resistance tolerance (O): 550; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 112; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 3.0x2.5(t=2.5); Number of terminal: 2; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 1;
Schottky Barrier Diodes; Package: TO220FN; Constitution materials list: Packing style: Bulk; Package quantity: 500;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 108.4; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 81.3; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 56; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 54.2; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 2.6x1.6(t=0.8); Number of terminal: 2; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 0.7;
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 1.9x1.3(t=0.6); Number of terminal: 2; Reverse voltage VR(V): 100; Average rectified forward current IO(A): 0.5;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 300; Print width (mm): 54.2; Resistance tolerance (O): 850; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 203; Print width (mm): 112; Resistance tolerance (O): 550; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 300; Print width (mm): 108.4; Resistance tolerance (O): 850; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
High Sensitivity Chip Sensors Sideview Type; Type: Surface Mount Type; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±12; Dark current ICEO (Max.)(µA): 0.5; Response time tr·tf (µA): 10; Yes;
Reflective Type Photosensors (Photoreflectors); Type: Cased Type; Light Emitting Diode: 630; Phototransistor: 600; Collector current IC (Min.)(mA): 0.08; Response time tr·tf (µs): 10;
Photointerrupter General Type; Packing style: Plastic bag; Package quantity: 400; 塑料无引线芯片载
Plastic Leadless Chip Carrier 塑料无引线芯片载
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 80; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24; 塑料无引线芯片载
Lead Frame Remote Control Receiver Modules (5V Type); Packing style: Stick; Package quantity: 1000; 塑料无引线芯片载
660/780nm Dual Wave Low Power Lasers; Packing style: Tray; Package quantity: 500; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 15x10(t=4.5); Number of terminal: 3; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 20; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 15x10(t=4.5); Number of terminal: 3; Reverse voltage VR(V): 400; Average rectified forward current IO(A): 20; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 5.5x6.5(t=2.3); Number of terminal: 3; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 6;
|
Vishay Intertechnology,Inc.
Vishay Intertechnology, Inc.
|
| 70287-1195 |
2.54mm (.100) Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 100 Circuits, 8.13mm
|
Molex Electronics Ltd.
|
| 87663-4002 |
6.35mm (.250) Pitch Power (DC), 7.62mm (.300) Pitch Power (AC), 2.54mm (.100) Pitch Signal, EXTreme PowerPlus?/a> Board-to-Board Header, Right Angle, 33 Circuits
|
Molex Electronics Ltd.
|
| SFX9130J |
10 AMP /100 Volts 300 mΩ P-Channel MOSFET
10 AMP /100 Volts 300 mヘ P-Channel MOSFET
10 AMP /100 Volts 300 mOMH P-Channel MOSFET
|
SSDI[Solid States Devices, Inc]
|
| 2109-1-00-01-00-00-07-0 2113-3-00-01-00-00-07-0 21 |
BRASS, TIN LEAD (200) OVER NICKEL FINISH, PCB TERMINAL
BRASS, SILVER (300) OVER COPPER FINISH, PCB TERMINAL
|
MILL-MAX MFG CORP
|
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